Cooler Master High Performance Thermal Paste - (HTK-002-U1)

Cooler Master High Performance Thermal Paste - (HTK-002-U1)
by Cooler Master USA, Inc.

Cooler Master High Performance Thermal Paste - (HTK-002-U1)
List Price: $5.99
Our Price: $1.29
You Save: $4.70 (78%)
Availability: Usually ships in 1-2 business days
Category: CE
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Customers in the UK, Buy this product at amazon.co.uk for British Pounds

Digital Photo Product Details

Manufacturer: Cooler Master USA, Inc.
Model: HTK-002-U1
Color: Black
Product features:
  • Suitable for CPU, chipsets on Mainboard, VGA card, etc.
  • Easy to use.
  • Zif Socket Templates ensure correct applying area with various CPU socket types.
  • Produces an even layer when using applicator.
  • Wide range of application temperature.

Digital Cameras Photo Reviews of Cooler Master High Performance Thermal Paste - (HTK-002-U1)

Customer Review: Designed for flawless usage
Summary: 4 Stars

This product works to ensure good thermal conductivity between a CPU and its Heat Sink. It is a composite of various metal oxides, hence its white color. It is designed to be easily applied correctly.

What's in the package:

- Thermal Compound
- Socket Template Stickers (2: for sockets A, 370, 7 and socket 423)
- Compound Applicator/Spreader

Instructions:

Very comprehensive, given in a step by step method, easy to follow.

Properties:

- Resists changes in consistency up to 177 degrees C
- Viscosity: Non flowing
- Specific Gravity: 2.37
- Dielectric Constant: 4.4 at 100kHz
- Volume Resistivity: 5.0 x 10 to the 15 power
- Dissipation fctor: 0.02 at 100KHz
- Dielectric Strength: 550 volts/mil; 21.7 kV/mm
- Thermal Conductivity: 0.8 watts/meter

This product, because of its compositon, should not be touched, and it should be kept out of the reach of children.

Description of Cooler Master High Performance Thermal Paste - (HTK-002-U1)

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

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